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| DATA SHEET BAV301~BAV303 HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODES VOLTAGE 100 to 200 Volts POWER 300 mWatts MICRO-MELF Unit : inch (mm) FEATURES * Fast switching Speed. * Surface Mount Package Ideally Suited For Automatic Insertion. * Silicon Epitaxal Planar Construction. MECHANICAL DATA * Case: Micro Melf, Glass * Terminals: Solderable per MIL-STD-202E, Method 208 * Polarity: Cathode Band * Marking: Cathode Band Only * Weight: 0.01 grams * Packing information T/R - 2.5K per 7" plastic Reel .043(1.1) .008(0.2) .008(0.2) .079(2.0) .071(1.8) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ =25C unless otherwise noted) PARAMETER Reverse Voltage Peak Reverse Voltage Rectified Current (Average), Half Wave Rectification with Resistive Load and f >=50 Hz Peak Forward Surge Current, t=1.0s Power Dissipation Derate Above at 25O C Maximum Forward Voltage, IF = 100mA Maximum DC Reverse Current at Rated DC Blocking Voltage TJ= 25O C Typical Junction Capacitance( Note 1) Maximum Reverse Recovery (Note 2) Maximum Thermal Resistance Operation Junction Storage Temperature Range SYMBOL VR VRM IO IFSM PD VF IR CJ TRR RJA TSTG BAV301 100 120 BAV302 150 200 200 1.0 300 1.0 0.1 0.95 75 350 -65 TO +175 O BAV303 200 250 .049(1.25) .047(1.2)DIA. UNITS V V mA A mW V uA pF ns C/W O C NOTE: 1. CJ at VR=0, f=1MHZ 2. From IF=10mA to IR=-1mA, VR=6Volts, RL=100 STAD-JAN.27.2004 PAGE . 1 RATING AND CHARACTERISTIC CURVES 100 1.1 1.0 0.9 0.8 0.7 0.6 .8 1.2 1.6 FORWARD CURRENT, mA 10 -25 C 25 C O O 1.0 75 C T A =125 C O O CAPACITANCE, pF 0.2 0 .4 0 1 2 3 4 5 FORWARD VOLTAGE, VOLTS REVERSE VOLTAGE, VOLTS F i g . 1 FORWARD CHARACTERISTICS Fig.2 TYPICAL CAPACITANCE vs REVERSE VOLATGE 14 12 10 8 6 4 2 0 SURGE CURRENT, A 0 1 10 100 1000 PULSE WIDTH, ms Fig. SURGE CURRENT CHARACTERISTIC STAD-JAN.27.2004 PAGE . 2 |
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